Semiconductor Wafer Dicing System

Semiconductor Wafer Dicing System

Accurately and precisely dicing semiconductor wafers into discrete die requires high response servo motors for the X, Y and Z axes and a high speed brushless spindle motor for the diamond dicing saw.

Allied Motion’s Quantum series BLDC servo motors, X-Drive series digital drives, and frameless Megaflux torque motors provide an optimum motion package for advanced wafer dicing.

NEED A CUSTOM SOLUTION?

Allied Motion's engineers will work with you to develop a custom solution to meet your specific requirements.  We're here to help you every step of the way.

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